JPH0193770U - - Google Patents

Info

Publication number
JPH0193770U
JPH0193770U JP18873187U JP18873187U JPH0193770U JP H0193770 U JPH0193770 U JP H0193770U JP 18873187 U JP18873187 U JP 18873187U JP 18873187 U JP18873187 U JP 18873187U JP H0193770 U JPH0193770 U JP H0193770U
Authority
JP
Japan
Prior art keywords
flexible board
multilayer flexible
multilayer
sided
stacking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18873187U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18873187U priority Critical patent/JPH0193770U/ja
Publication of JPH0193770U publication Critical patent/JPH0193770U/ja
Pending legal-status Critical Current

Links

JP18873187U 1987-12-11 1987-12-11 Pending JPH0193770U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18873187U JPH0193770U (en]) 1987-12-11 1987-12-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18873187U JPH0193770U (en]) 1987-12-11 1987-12-11

Publications (1)

Publication Number Publication Date
JPH0193770U true JPH0193770U (en]) 1989-06-20

Family

ID=31479804

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18873187U Pending JPH0193770U (en]) 1987-12-11 1987-12-11

Country Status (1)

Country Link
JP (1) JPH0193770U (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5408754B1 (ja) * 2012-12-10 2014-02-05 株式会社フジクラ 多層配線基板及びその製造方法
WO2024205067A1 (ko) * 2023-03-27 2024-10-03 삼성전자 주식회사 다층 연성 인쇄 회로 기판을 포함하는 전자 장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5408754B1 (ja) * 2012-12-10 2014-02-05 株式会社フジクラ 多層配線基板及びその製造方法
WO2024205067A1 (ko) * 2023-03-27 2024-10-03 삼성전자 주식회사 다층 연성 인쇄 회로 기판을 포함하는 전자 장치

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